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PM lays foundation of three semiconductor projects worth about Rs 1.25 lakh crore

Modi said India is set to become a prominent semiconductor manufacturing hub, adding that the three facilities will drive economic growth and foster innovation.

PM lays foundation of three semiconductor projects worth about Rs 1.25 lakh crore

(ANI Photo)

In line with Prime Minister Narendra Modi’s vision to position India as a global hub for semiconductor design, manufacturing and technology development, the premier laid the foundation stone of three semiconductor projects worth about Rs 1.25 lakh crore on Wednesday.

The Prime Minister laid foundation stone for the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam; and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat.

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He said India is set to become a prominent semiconductor manufacturing hub, adding that the three facilities will drive economic growth and foster innovation.

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He said, ”The 21st century is a technology-driven century and cannot be imagined without electronic chips. Made In India Chip, Designed In India Chip, will take India towards self-reliance and modernity.”

The PM stated that through these facilities, the semiconductor ecosystem will be strengthened and will get a firm footing in India.

”These units will also provide employment to thousands of youth in the semiconductor industry as well as catalyse employment generation in related sectors like electronics and telecom, he said.

In his virtual address, Modi said “Due to various reasons, India was left behind during the first and the second industrial revolutions. However, India is pioneering Industry 4.0 with confidence.

“…Today’s event is an event of the dreams of the youth…The real stakeholders of the future of India are the youth…Today the youth are seeing how India is working all-round for progress, for self-reliance and for its presence in the global supply chain.”

The Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up of Semiconductor Fabs in India. With a total investment of over Rs. 91,000 crore, this will be the first commercial semiconductor fab in the country.

The Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 27,000 crore.

The Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, will be set up by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 7,500 crore.

He took part in the ‘India’s Techade: Chips for Viksit Bharat’ programme.

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